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 Embedded Hardware
  

  Embedded Hardware by Jack G. Ganssle ; Tammy Noergaard ; Fred Eady ; Lewin Edwards ; David J. Katz ; Rick Gentile ; Ken Arnold ; Kamal Hyder ; Bob Perrin

  • Published by: NEWNES
  • Author: Jack G. Ganssle ; Tammy Noergaard ; Fred Eady ; Lewin Edwards ; David J. Katz ; Rick Gentile ; Ken Arnold ; Kamal Hyder ; Bob Perrin
  • Page Count: 520
  • Group: CHIP - GENERAL
  • ISBN: 0750685840/9780750685849
  • Published: Nov 2007

Our Price: 23.99
Discount: 20%
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Book Information and Description:

Embedded Hardware
The Newnes Know It All Series takes the best of what our authors have written to create hard-working desk references that will be an engineer's first port of call for key information, design techniques and rules of thumb. Guaranteed not to gather dust on a shelf!

Circuit design using microcontrollers is both a science and an art. This book covers it all. It details all of the essential theory and facts to help an engineer design a robust embedded system. Processors, memory, and the hot topic of interconnects (I/O) are completely covered. Our authors bring a wealth of experience and ideas; this is a must-own book for any embedded designer.

*A 360 degree view from best-selling authors including Jack Ganssle, Tammy Noergard, and Fred Eady

*Key facts, techniques, and applications fully detailed

*The ultimate hard-working desk reference: all the essential information, techniques, and tricks of the trade in one volume

CONTENTS:

CHAPTER 1: Embedded Hardware Basics

1.1 Lesson One on Hardware: Reading Schematics

1.2 The Embedded Board and the von Neumann Model

1.3 Powering the Hardware

1.4 Basic Electronics

1.4.1 DC Circuits

1.4.2 AC Circuits

1.4.3 Active Devices

1.5 Putting It Together: A Power Supply

1.6 Endnotes

CHAPTER 2: Logic Circuits

2.1 Coding

2.1.1 BCD

2.2 Combinatorial Logic

2.2.1 NOT Gate

2.2.2 AND and NAND Gates

2.2.3 OR and NOR Gates

2.2.4 XOR

2.2.5 Circuits

2.2.6 Tristate Devices

2.3 Sequential Logic

2.3.1 Logic Wrap-Up

2.4 Putting It All Together: The Integrated Circuit

2.5 Endnotes

CHAPTER 3: Embedded Processors

3.2 ISA Architecture Models

3.2.1 Operations

3.2.2 Operands

3.2.3 Storage

3.2.4 Addressing Modes

3.2.5 Interrupts and Exception Handling

3.2.6 Application-Speci?c ISA Models

3.2.7 General-Purpose ISA Models

3.2.8 Instruction-Level Parallelism ISA Models

3.3 Internal Processor Design

3.3.1 Central Processing Unit (CPU)

3.3.2 On-Chip Memory

3.3.3 Processor Input/Output (I/O)

3.3.4 Processor Buses

3.4 Processor Performance

3.4.1 Benchmarks

3.5 Endnotes

CHAPTER 4: Embedded Board Buses and I/O

4.1 Board I/O

4.2 Managing Data: Serial vs. Parallel I/O

4.2.1 Serial I/O Example 1: Networking and Communications: RS-232

4.2.2 Example: Motorola/Freescale MPC823 FADS Board RS-232 System Model

4.2.3 Serial I/O Example 2: Networking and Communications: IEEE 802.11 Wireless LAN

4.2.4 Parallel I/O

4.2.5 Parallel I/O Example 3: Parallel Output and Graphics I/O

4.2.6 Parallel and Serial I/O Example 4: Networking and Communications - Ethernet

4.2.7 Example 1: Motorola/Freescale MPC823 FADS Board Ethernet System Model

4.2.8 Example 2: Net Silicon ARM7 (6127001) Development Board Ethernet System Model

4.2.9 Example 3: Adastra Neptune x86 Board Ethernet System Model

4.3 Interfacing the I/O Components

4.3.1 Interfacing the I/O Device with the Embedded Board

4.3.2 Interfacing an I/O Controller and the Master CPU

4.4 I/O and Performance

4.5 Board Buses

4.6 Bus Arbitration and Timing

4.6.1 Nonexpandable Bus: I2C Bus Example

4.6.2 PCI (Peripheral Component Interconnect) Bus Example: Expandable

4.7 Integrating the Bus with Other Board Components

4.8 Bus Performance

4.9 Endnotes

CHAPTER 5: Memory Systems

5.1 Introduction

5.2 Memory Spaces

5.2.1 L1 Instruction Memory

5.2.2 Using L1 Instruction Memory for Data Placement

5.2.3 L1 Data Memory

5.3 Cache Overview

5.3.1 What Is Cache?

5.3.2 Direct-Mapped Cache

5.3.3 Fully Associative Cache

5.3.4 N-Way Set-Associative Cache

5.3.5 More Cache Details

5.3.6 Write-Through and Write-Back Data Cache

5.4 External Memory

5.4.1 Synchronous Memory

5.4.2 Asynchronous Memory

5.4.3 Nonvolatile Memories

5.5 Direct Memory Access

5.5.1 DMA Controller Overview

5.5.2 More on the DMA Controller

5.5.3 Programming the DMA Controller

5.5.4 DMA Classifications

5.5.5 Register-Based DMA

5.5.6 Descriptor-Based DMA

5.5.7 Advanced DMA Features

5.6 Endnotes

CHAPTER 6: Timing Analysis in Embedded Systems

6.1 Introduction

6.2 Timing Diagram Notation Conventions

6.2.1 Rise and Fall Times

6.2.2 Propagation Delays

6.2.3 Setup and Hold Time

6.2.4 Tri-State Bus Interfacing

6.2.5 Pulse Width and Clock Frequency

6.3 Fan-Out and Loading Analysis: DC and AC

6.3.1 Calculating Wiring Capacitance

6.3.2 Fan-Out When CMOS Drives LSTTL

6.3.3 Transmission-Line Effects

6.3.4 Ground Bounce

6.4 Logic Family IC Characteristics and Interfacing

6.4.1 Interfacing TTL Compatible Signals to 5 V CMOS

6.5 Design Example: Noise Margin Analysis Spreadsheet

6.6 Worst-Case Timing Analysis Example

6.7 Endnotes

CHAPTER 7: Chooosing a Microcontroller and Other Design Decisions

7.1 Introduction

7.2 Choosing the Right Core

7.3 Building Custom Peripherals with FPGAs

7.4 Whose Development Hardware to Use - Chicken or Egg?

7.5 Recommended Laboratory Equipment

7.6 Development Toolchains

7.7 Free Embedded Operating Systems

7.8 GNU and You: How Using Free Software Affects Your Product

CHAPTER 8:The Essence of Microcontroller Networking: RS-232

8.1 Introduction

8.2 Some History

8.3 RS-232 Standard Operating Procedure

8.4 RS-232 Voltage Conversion Considerations

8.5 Implementing RS-232 with a Microcontroller

8.5.1 Basic RS-232 Hardware

8.5.2 Building a Simple Microcontroller RS-232 Transceiver

8.6 Writing RS-232 Microcontroller Routines in BASIC

8.7 Building Some RS-232 Communications Hardware

8.7.1 A Few More BASIC RS-232 Instructions

8.8 I2C: The Other Serial Protocol

8.8.1 Why Use IC?

8.8.2 The IC Bus

8.8.3 IC ACKS and NAKS

8.8.4 More on Arbitration and Clock Synchronization

8.8.5 IC Addressing

8.8.6 Some IC Firmware

8.8.7 The AVR Master IC Code

8.8.8 The AVR IC Master-Receiver Mode Code

8.8.9 The PIC IC Slave-Transmitter Mode Code

8.8.10 The AVR-to-PIC IC Communications Ball

8.9 Communication Options

8.9.1 The Serial Peripheral Interface Port

8.9.2 The Controller Area Network

8.9.3 Acceptance Filters

8.10 Endnotes

CHAPTER 9: Interfacing to Sensors and Actuators

9.1 Introduction

9.2 Digital Interfacing

9.2.1 Mixing 3.3 and 5 V Devices

9.2.2 Protecting Digital Inputs

9.2.3 Expanding Digital Inputs

9.2.4 Expanding Digital Outputs

9.3 High-Current Outputs

9.3.1 BJT-Based Drivers

9.3.2 MOSFETs

9.3.3 Electromechanical Relays

9.3.4 Solid-State Relays

9.4 CPLDs and FPGAs

9.5 Analog Interfacing: An Overview

9.5.1 ADCs

9.5.2 Project 1: Characterizing an Analog Channel

9.6 Conclusion

9.7 Endnotes

CHAPTER 10: Other Useful Hardware Design Tips and Techniques

10.1 Introduction

10.2 Diagnostics

10.3 Connecting Tools

10.4 Other Thoughts

10.5 Construction Methods

10.5.1 Power and Ground Planes

10.5.2 Ground Problems

10.6 Electromagnetic Compatibility

10.7 Electrostatic Discharge Effects

10.7.1 Fault Tolerance

10.8 Hardware Development Tools

10.8.1 Instrumentation Issues

10.9 Software Development Tools

10.10 Other Specialized Design Considerations

10.10.1 Thermal Analysis and Design

10.10.2 Battery-Powered System Design Considerations

10.11 Processor Performance Metrics

10.11.1 IPS

10.11.2 OPS

10.11.3 Benchmarks

APPENDIX A: Schematic Symbols

APPENDIX B: Acronyms and Abbreviations

APPENDIX C: PC Board Design Issues

C.1 Introduction

C.2 Resistance of Conductors

C.3 Voltage Drop in Signal Leads - Kelvin Feedback

C.4 Signal Return Currents

C.5 Grounding in Mixed Analog/Digital Systems

C.6 Ground and Power Planes

C.7 Double-Sided versus Multilayer Printed Circuit Boards

C.8 Multicard Mixed-Signal Systems

C.9 Separating Analog and Digital Grounds

C.10 Grounding and Decoupling Mixed-Signal ICs with Low Digital Currents

C.11 Treat the ADC Digital Outputs with Care

C.12 Sampling Clock Considerations

C.13 The Origins of the Confusion About Mixed-Signal Grounding: Applying Single-Card Grounding Concepts to Multicard Systems

C.14 Summary: Grounding Mixed-Signal Devices with Low Digital Currents in a Multicard System

C.15 Summary: Grounding Mixed-Signal Devices with High Digital Currents in a Multicard System

C.16 Grounding DSPs with Internal Phase-Locked Loops

C.17 Grounding Summary

C.16 Some General PC Board Layout Guidelines for Mixed-Signal Systems

C.19 Skin Effect

C.20 Transmission Lines

C.21 Be Careful with Ground Plane Breaks

C.22 Ground Isolation Techniques

C.23 Static PCB Effects

C.24 Sample MINIDIP and SOIC Op Amp PCB Guard Layouts

C.25 Dynamic PCB Effects

C.26 Stray Capacitance

C.27 Capacitive Noise and Faraday Shields

C.28 The Floating Shield Problem

C.29 Buffering ADCs Against Logic Noise

C.28 Endnotes